Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC
Mixed-signal 3D-ICs have a stacked structure of digital and analog circuit chips.In this study, the effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC.The noise Toddler Pillow propagation via through-silicon vias (TSVs) was measured, with a ring-oscillator as a noise source.For a